A virtual reflow profile is based upon soldering theory, the recommended solder profile from the solder paste manufacturer, size, thickness, cooper weight, layers of the board and size, and the density of the components.
Reflow the board and measure the real time thermal profile simultaneously.
Check the solder joint quality, PCB and component status.
Burn-in a test board with thermal shock and mechanical shock to check the board’s reliability.Compare real-time thermal data with the virtual profile.
Adjust the parameter setup and test several times to find the upper limit and bottom line of the real-time reflow profile.
Save optimized parameters as per the target board’s reflow specification.