In theproduction of hybrid assembled PCBA, selective wave soldering technology isbecoming a key process for improving the qualification rate of complex circuitboards due to its targeted soldering ability. This technology achievesdirectional welding of specific solder joints by precisely controlling thespray area of solder waves, perfectly adapting to the production needs of"mixed packaging" and "multi variety" in modern electronicmanufacturing.
Technicalprinciple: Selective wave soldering uses a programmable nozzle system to spraymolten tin waves only on the pin areas of through-hole components that need tobe soldered on the PCBA. Unlike traditional wave soldering with full immersion,it uses local heating to minimize the heat affected zone and reduce solderoxidation through nitrogen protection of the nozzle.
Qualityadvantage:
·Avoidsecondary thermal damage to surface mount components, especially suitable formixed board production
·Accuratelyadjust the tin wave pressure for different solder joint diameters to reducedefects such as bridging and pulling
·Singlenozzle switching time is less than 0.5 seconds, meeting the flexible productionneeds of small batches and multiple varieties
·Solderutilization rate increased by 40%, reducing consumable costs and waste disposalpressure
Applicationfield: Widely used in PCBA production with multiple process combinations
·Smarthome control board (including mixed chip IC and connector)
·Industrialinstrument motherboard (integrating sensors and power devices)
·Automotiveradar module (including high-frequency components and connectors)
·RailTransit Signal Control Board
Withthe mixed integration of surface mount and through-hole components in PCBAbecoming mainstream, selective wave soldering technology is breaking throughthe bottleneck of traditional processes through "precise soldering".It can ensure the stability of welding quality and adapt to the flexiblerequirements of flexible manufacturing, providing important support for thediversified development of PCBA production.