In recent years, as electronic products evolve toward lighter weight, slimmer profiles, higher integration, and greater personalization, the market demand for flexible printed circuit boards (FPCs) and rigid-flex PCBs has continued to rise. These circuit boards combine the advantages of both flexible and rigid sections—offering bendability for flexible space layouts while providing sufficient mechanical support and high-density routing in critical areas—making them an important choice in high-end electronic design.
Flexible PCBs are lightweight and thin, capable of folding and rolling freely in three-dimensional space, making them particularly suitable for wearable devices, foldable smartphones, and other products requiring extreme structural flexibility. Rigid-flex PCBs, on the other hand, integrate flexible and rigid layers into a single structure, eliminating the need for traditional connectors and cables, thereby reducing signal loss, improving reliability, and optimizing internal space utilization. This makes them especially valuable in automotive electronics and medical instruments, where vibration resistance, durability, and stability are critical.
In the automotive field, rigid-flex PCBs are widely used in advanced driver-assistance systems (ADAS), central control systems, and battery management systems (BMS). They can withstand high temperatures and vibrations during vehicle operation while enabling complex wiring in limited installation space. In the medical sector, they are used in minimally invasive surgical instruments and wearable monitoring devices, supporting miniaturization and high-precision signal transmission.
With the rapid growth of 5G, the Internet of Things (IoT), and new energy vehicles, flexible and rigid-flex PCBs are becoming a key component in future electronic design. As manufacturing processes mature and costs gradually decrease, their penetration across consumer electronics, automotive, and medical industries is expected to deepen, unlocking even greater market potential.