Blind and buried via technology is a keyinterconnection solution in modern high-density PCB design, including blindvias that only connect the outer layer to the inner layer and buried vias thatare completely located inside the inner layer. Compared with traditionalthrough-holes, this technology can increase the wiring density by 30%-50%,shorten the signal transmission path, optimize impedance control, andsignificantly improve space utilization. Its manufacturing process involves keytechnologies such as precision laser drilling (minimum aperture 50μm), chemicalcopper plating (copper thickness uniformity ±5μm) and sequential lamination,and the process complexity is about 40% higher than that of conventional PCBs.
The core advantages of this technology arereflected in electrical performance and structural design: it can reduce signalreflection by 30%-40% electrically and improve signal integrity; it supportsultra-thin board thickness of 0.2mm in structure, providing higher wiringfreedom. It is currently widely used in 5G communication equipment, smartphones, servers, automotive electronics, aerospace and other fields. With theminiaturization of electronic devices, blind and buried via technology isdeveloping towards smaller apertures (30μm) and higher aspect ratios (10:1),and is deeply integrated with IC substrate technology, playing an irreplaceablerole in emerging fields such as 5G, AI and the Internet of Things. Despite itshigh cost, its technical advantages in high-performance electronic devices makeit an important development direction for modern PCB manufacturing.
Our company BQC, has two factories inShenzhen and Malaysian PCB Assembly with over 22 years of experience inhigh-quality PCBA manufacturing, is actively. Our new factory in Penang,Malaysia, began sample trial production in late April 2025 and is equipped withadvanced SMT and reflow soldering lines. The Penangplant was specificallydesigned to serve high-reliability markets such as industrial controls, medicaldevices, and automotive electronics.