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    Industry NewsNews > Industry News > PCB manufacturability design and PCBA assembly design    

    PCB manufacturability design and PCBA assembly design

    Hits:1  Add Date:2021/12/8

    PCBA manufacturability design and PCB manufacturability design, look only A "A", in fact, there is A big difference, PCBA manufacturability design includes PCB manufacturability design and PCBA manufacturability design (or assembly design) two parts.

     

    PCB manufacturability design focuses on "manufacturability", including plate selection, pressing structure, ring design, welding resistance design, surface treatment and plate design, etc. These designs are all related to the processing capacity of PCB. Limited by the processing method and capacity, the minimum line width and line distance, the minimum aperture, the minimum ring width and the minimum welding resistance gap must conform to the processing capacity of PCB, and the designed lamination and pressing structure must conform to the processing technology of PCB. Therefore, the focus of PCB manufacturability design is to meet the process capacity of PCB factory, and to understand the production method, process flow and process capacity of PCB is the basis of the implementation of process design.

     

    The PCBA manufacturability design focuses on "assemblability", that is, the establishment of stable and solid technology, to achieve high quality, high efficiency and low cost of welding. The design includes package selection, pad design, assembly design, components layout, steel mesh design and so on. All these design requirements are based on higher welding yield, higher manufacturing efficiency and lower manufacturing cost. Therefore, it is very important to understand the process characteristics of various packaging, common welding defects and influencing factors.

     

    No matter PCB manufacturability design or PCBA manufacturability design, can not simply around the individual design elements, such as component selection, 0201 for mobile phone board is the most commonly used packaging, but not for communication board, in the design must be comprehensive and systematic overall consideration of the board technology, That is, the concept of "integration" design with repeated intensity.

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