1. Choose a suitable glue: commonly usedsilicone and epoxy potting glue, at least understand the "operating windowtime" and "curing time" parameters.
2. The temperature of PCBA before the gluecan be approximately the same as the temperature of the glue.
3. The PCB that needs to be sealed must beheated in a drying tunnel and baked to 50°C.
4. Too much flux residue needs to becleaned up to keep the PCBA surface clean.
5. It is best to inject glue into thepotting box first, and then put the PCBA into it.
6. The ratio of polyurethane potting gluemust be accurate. The two commonly used methods are 100:50 and 100:74, whichare all formulated according to the properties of the glue.
It is easy to produce air bubbles whenfilling the glue, which is a problem that needs to be paid attention to whenconducting PCBA glue filling.