Technologicalinnovation is constantly developing and changing. For example, in SMT chipprocessing, in addition to the most common chip processing methods of PCBcircuit boards and printed solder pastes that are soldered through reflowsoldering, we also have a lot of things based on product characteristics.Special processes, such as SMT, DIP plug-in, etc., among which ESC is also awelding process.

ESC(Epoxy Encapsulated Solder Connection) technology is an epoxy resin sealingsoldering method, which uses a new type of resin-wrapped solder to heat theconnection. ESC technology is a new technology that replaces ACF, whichsimplifies the process and reduces costs.

1.ESC technology process

First,apply solder paste resin glue to the pad of the hard board, then align andaffix the electrodes of the soft board to the pad of the hard board, andfinally achieve the soldering and resin curing by heating and pressing at thesame time.

Second,ESC and ACF technology comparison

BecauseACF technology has some shortcomings in process and connection strength. Theprocess of ACF is more complicated than ESC; ESC has the following advantagescompared with ACF:

①Theprocess is simple, saving the space for attaching ACF tape;

②Welding + resin curing, enhance the connection arc and improve reliability;

③More application areas.

3.Application of ESC technology

①New development of Flip Chip flip chip assembly process. ESC technology canrealize Flip Chip reflow soldering and underfill glue curing.

②MM-ESCtechnology (module and module combination technology).

③Combinationtechnology between connectorless substrates of new generation mobile phones

Theuse of ESC technology can realize the connectorless connection between the 5modules of the new generation mobile electronic language, which saves space,reduces the thickness of the machine, and also improves the connection strengthand reliability.