DIPplug-in post-welding processing is a process after SMT chip processing, and theprocessing process precautions are as follows:
1.Pre-processing of components
Thestaff of the pre-processing workshop picks up the materials from the BOMaccording to the BOM bill of materials, carefully checks the material model andspecifications, signs, and performs pre-processing according to the model(using automatic bulk capacitor shears, transistor automatic molding machine,fully automatic belt type Processing equipment such as molding machines).
Claim:
① The horizontal width of the adjusted component pin needs to be thesame as the width of the *** hole, and the tolerance is less than 5%;
② The distance between the component pins and the PCB pads should notbe too large;
③ If the customer requests, the part needs to be formed to providemechanical support and prevent the pad from lifting.
2.Paste high-temperature adhesive tape, enter the board → paste high-temperatureadhesive tape, and block the tin-plated through holes and components that mustbe soldered later;
3.DIP plug-in processing workers need to bring electrostatic rings, wearanti-static clothes and hats to prevent static electricity, and perform plug-inaccording to the component BOM list and component bit number diagram. Care mustbe taken when inserting the plug-in.
4.For the inserted components, check them, mainly check whether the componentsare inserted incorrectly or missed;
5.For the PCB board with no problems with the plug-in, the next step is wavesoldering. The wave soldering machine performs automatic soldering processing,which is a firm component.
6.Remove the high-temperature adhesive tape, and then check. In this step, themain inspection is to visually observe whether the soldered PCB board is weldedintact;
7.Repair and repair the PCBs that are found to be incompletely welded to preventproblems;
8.Post-welding, which is a process set for components with special requirements,because some components cannot be directly welded by wave soldering machinesaccording to the process and material limitations, and need to be completedmanually;
9.After all components are soldered to the PCB board, a functional test isperformed to test whether each function is normal. If a functional defect isdetected, repair and test processing is required.