For electronic assembly line automation, we think that PCBA processing and assembly is easier to do, or is PCBA testing easier? Many movements in the current assembly can be helped by the robot arm. Can testing be done?
A basic requirement in
PCBA assembly is consistency, correctness, control of differences, and variation not allowed. The poor quality in the assembly manufacturing process includes design issues, material issues, and assembly issues. The first two items need to be pre-emptied to prevent their occurrence. The problems in the assembly process are missing parts, damaged parts, wrong parts, and offsets. Most of them can be visually inspected, but the quality of the welding is difficult to judge completely by visual means, and sometimes there are failures such as blows, bursts, and malfunctions that the PCBA delivers to the customer.
According to the analysis and statistics of PCBA assembly quality problems provided by China Saibao Laboratory Reliability Analysis and Analysis Center, the main assembly failure mode is poor welding, which accounts for 57% of all assembly failure problems. It can be seen that the vast majority of product quality problems are caused by the assembly welding process. Solder joint failure caused.
As the design of PCBA tends to be miniaturized, smaller devices, smaller pitches, and more miniaturization (high density) of electronic assemblies, PCBA's solder joint defects, detection positioning difficulties, and visibility are caused. Poor repairability and even the potential for irreparable potential failure also increase.
Only from the traditional visual inspection and control of the assembly process can not completely eliminate the bad welding, but also need to carry out automatic X-ray non-destructive testing, has been promoted in the Yangtze River Delta, the Pearl River Delta, and military production, the effect is very good. However, the investment in additional equipment is relatively large. The labor costs have been increasing year after year. This has caused many small and medium-sized electronics manufacturing foundries to agonize. Coupled with the continuous requirements of customers on processing quality, weaker foundries have been unable to increase high cost detection methods.
